NeuroLinkage: Decodificación de Intención en Tiempo Real, Estimulación Epidural y Bucles Sub-20ms

NeuroLinkage desarrolla interfaces cerebro-computadora (BCIs) corticales de ultra alta densidad, transmitiendo miles de canales neuronales concurrentes desde microelectrodos intracorticales, ejecutando clasificación de espigas en chip y sintetizando habla articulada para pacientes tetrapléjicos.

NeuroLinkage High-Density Cortical BCI & Signal Processing Architecture

1024-channel cortical probe, on-chip spike sorting ASIC, and low-latency decoding server

Central System: Cortical BCI Processor - High-Density Spike Sorting Core

Clinical IoMT Nodes

  • High-Density Intracortical Microelectrode Array
  • On-Probe Neuromorphic Digitizer ASIC
  • Real-Time Neural Spike Sorting Core
  • Motor & Speech Intent Neural Decoder
  • Assistive Communication / Exoskeleton Sink

Architectural Layers & Regulatory Standards

  • Intracortical Silicon / Polymer Probes (Neuropixels Architecture / Flexible Polyimide Shanks): Recording extracellular single-unit action potentials from pyramidal neurons across cortical layers I-VI.
  • Ultra-Low Power Neural Signal Digitization (Analog Front-End ASIC / 30 kHz Per Channel Sampling): Digitizing hundreds of raw electrical channels directly at the skull interface without thermal tissue heating.
  • On-Edge Neural Spike Detection & Sorting (Threshold Crossing / Waveform Feature Clustering): Isolating individual neuronal action potentials from background multi-unit hash in real time.
  • High-Bandwidth Intent Decoding & Synthesis (Temporal Convolutional Networks / RNN Language Models): Decoding cortical motor intent into continuous 2D/3D cursor kinematics or acoustic phoneme sequences.

Key Metrics: 1024 Channels (Simultaneous Cortical Recording) | < 0.5°C (Implantable Thermal Dissipation Rise) | 90 WPM (Decoded Speech Synthesis Rate) | < 25 ms (Brain-to-Actuator Latency)

Enlace Neural Cortical, Matrices de Microelectrodos de Alta Densidad y Neuromodulación por Clasificación de Picos

Referencia técnica de ingeniería autorizada para cortical neural linkage, high-density microelectrode arrays & spike sorting neuromodulation en regulaciones FDA 510(k), EU MDR, ciclo de vida IEC 62304 Clase C e interoperabilidad IoMT.

Core Engineering Areas

Technical Articles

Related Cluster Architecture Specifications